DocumentCode
1845403
Title
An integrated MEMS tactile tri-axial micro-force probe sensor for Minimally Invasive Surgery
Author
Wang, Weizhong ; Zhao, Yulong ; Lin, Qijing
Author_Institution
State Key Lab. of Mech. Manuf. Syst., Xi´´an Jiaotong Univ., Xi´´an, China
fYear
2009
fDate
18-21 Oct. 2009
Firstpage
71
Lastpage
76
Abstract
In this paper, we describes an integrated MEMS tactile tri-axial micro-force probe sensor based on piezoresistive for Minimally Invasive Surgery (MIS) as it´s micro-structure, three-dimensional measurement and high resolution up to be micronewton (μN) scale. The sensor is 4 × 4 × 20.9 mm3. The sensing element of the sensor is fabricated on Silicon on Insulator (SOI) wafer by surface and bulk micromachining technology. It uses four cantilever beams supporting the suspended mass. Twelve relief pieoresisters formed by iron implant and Inductive Couple Plasmas (ICP) etching technology are placed on the beams to detect the applied force. The pyrex glass bonded on the bottom of the SOI wafer by anodic bonding technology is the overload protection element. The tactile element is the quartz fiber probe which is no-pollution, low cost, small size and easy to process. It is glued on suspended mass of the sensing element by epoxy resin. After fabrication, the sensor is packaged and tested by precision test bench and analytical balance. The experimental results illustrate that the sensor has excellent characteristics especially with resolution better than 3μN.
Keywords
bioMEMS; biosensors; microsensors; silicon-on-insulator; sputter etching; 3D measurement; ICP etching technology; Inductive Couple Plasmas etching technology; Silicon on Insulator wafer; bulk micromachining; integrated MEMS tactile sensor; microforce probe sensor; microstructure; minimally invasive surgery; pyrex glass; surface micromachining; triaxial sensor; Gold; Micromechanical devices; Particle beams; Sensors; Silicon; MEMS; Micro-force; Minimally Invasive Surgery; Probe sensor; Tri-axial;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Molecular Medicine and Engineering (NANOMED), 2009 IEEE International Conference on
Conference_Location
Tainan
Print_ISBN
978-1-4244-5528-7
Type
conf
DOI
10.1109/NANOMED.2009.5559117
Filename
5559117
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