DocumentCode :
1845531
Title :
Fabrication of full glass chips with hybrid micro- and nanochannels and their application to protein concentration
Author :
He, Qiaohong ; Lu, Hua ; Chen, Shuang ; Chen, Hengwu
Author_Institution :
Dept. of Chem., Zhejiang Univ., Hangzhou, China
fYear :
2009
fDate :
18-21 Oct. 2009
Firstpage :
44
Lastpage :
47
Abstract :
In this paper, we proposed an alternative method that is simple and cost-effective to fabricate full glass chips with hybrid micro- and nanochannels. Double-lithography and double wet-etching technique was used for the fabrication of hybrid micro and nanostructures. The microchannels were firstly constructed on a glass substrate by standard UV photolithography and wet etching technique. After washing away the rest photoresist and spinning a new layer of photoresist on the microchannel-structured glass substrate, nanochannels with the depth less than 100 nm were produced on the same substrate by second lithography and wet etching. Then the channels-structured glass substrate was sealed to a cover glass plate by using previously developed room temperature bonding technique. Without using clean room facilities and expensive instruments, micro- and nanofluidic chips with delicate structures were well fabricated. The good nature of those nanofluidic chips was demonstrated by the successful concentration of FITC-labeled bovine serum albumin via electrokinetic ion trapping.
Keywords :
electrokinetic effects; etching; glass; microfluidics; nanofabrication; nanofluidics; ultraviolet lithography; FITC-labeled bovine serum albumin; UV photolithography; double wet-etching technique; double-lithography; electrokinetic ion trapping; full glass chip; microchannel-structured glass substrate; nanochannel; nanofluidic chip; photoresist; protein concentration; room temperature bonding technique; Substrates; chip fabrication; double-etching technique; micro- and nanofluidic chips; protein concentration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Molecular Medicine and Engineering (NANOMED), 2009 IEEE International Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-5528-7
Type :
conf
DOI :
10.1109/NANOMED.2009.5559123
Filename :
5559123
Link To Document :
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