DocumentCode
1845540
Title
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
fYear
2002
fDate
1-1 June 2002
Abstract
The following topics are dealt with: thermal phenomena; air cooling limits; advanced simulation methods for electronics cooling; compact models; integrated biochips; MEMS; thermal management; power electronics systems; convection cooling; heat pipes; heat sink characterization; high flux liquid cooling; thermal CAD; computational methods; reliability characterization.
Keywords
computational fluid dynamics; cooling; electronic engineering computing; heat sinks; power electronics; reliability; thermal management (packaging); thermal stresses; CAD methods; MEMS thermal management; advanced simulation methods; air cooling limits; compact models; computational methods; convection cooling; data-voice equipment; electronic systems; heat pipes; heat sinks; high flux liquid cooling; power electronics; reliability; thermal phenomena; thermomechanical phenomena; Cooling; Power electronics; Reliability; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Conference_Location
San Diego, CA, USA
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012430
Filename
1012430
Link To Document