Title :
A Test Board for Multiport Immittance Measurement and Characterization of RF-IC Packages
Author :
Tripathi, Alok ; Lutz, Rick ; Tripathi, V.K. ; Wu, Henry Hungjen ; Meyer, Jeffrey W. ; Hutchison, Brian
Author_Institution :
Department of Electrical & Computer Engineering, Oregon State University, Corvallis, OR 97331
Abstract :
An experimental technique based on the measurement of two port scattering parameters for the characterization of electrically small RF-IC package is presented. The procedure is based on a novel test board design to facilitate extraction of n-port admittance and impedance matrix parameters using two port network analyzer scattering parameter measurements. An optimization routine is used to extract the SPICE based equivalent circuit model that includes the mutual coupling effects present in the RF-IC package pins.
Keywords :
Admittance measurement; Circuit testing; Electric variables measurement; Equivalent circuits; Impedance measurement; Mutual coupling; Packaging; Pins; SPICE; Scattering parameters;
Conference_Titel :
ARFTG Conference Digest-Spring, 51st
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1998.327297
