• DocumentCode
    1845710
  • Title

    Analysis of Microvia Interconnects

  • Author

    Abhari, Ramesh ; Van Deventer, T.E.

  • Author_Institution
    Department of Electrical and Computer Engineering University of Toronto, 10 King¿s College Road, Ontario M5S 3G4, CANADA
  • Volume
    33
  • fYear
    1998
  • fDate
    35947
  • Firstpage
    163
  • Lastpage
    166
  • Abstract
    The development of high density circuitry has promoted the introduction of the microvia technology which relies on organic dielectrics and vertical interconnects of reduced dimensions. In this paper, microvia interconnects are evaluated both through simulation using an FDTD model and experimental measurements, and have shown good electrical performance.
  • Keywords
    Circuit simulation; Dielectric measurements; Dielectric substrates; Etching; Finite difference methods; Integrated circuit interconnections; Nonhomogeneous media; Plasma applications; Reflection; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 51st
  • Conference_Location
    Baltimore, MD, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1998.327298
  • Filename
    4119987
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1845710