• DocumentCode
    1845756
  • Title

    Application of lumped RthCth and approximate steady-state methods for reducing transient analysis solution time

  • Author

    Larson, Steven E.

  • Author_Institution
    Automotive Commun. & Electron. Syst. Group, Motorola Inc., Northbrook, IL, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    85
  • Lastpage
    90
  • Abstract
    Three-dimensional, transient computational fluid-dynamic (CFD) models require finite-volume grids in the spatial as well as temporal domain. The grid can become extremely large, even for component-level problems. This initially results in long computation times during grid optimization, even with high-speed and parallel processing computers. It also results in extremely long computation times once the grid has been optimized. Solution times are further increased when the transient load is cyclic in nature. To reduce computation time, lumped resistance-capacitance (RthCth) methods developed by Larson and Li [2000] were benchmarked at the component level, then the system level. Next, the use of root-mean-squared current (I.) as a steady-state approximation was benchmarked at both the component and system level. Finally, both methods were applied to streamline the analysis of automotive electronic controls. Limitations of both the RthCth and steady-state methods are discussed. Cycle time reduction values for both component and system level are presented.
  • Keywords
    automotive electronics; computational fluid dynamics; finite volume methods; natural convection; packaging; transient analysis; approximate steady-state methods; automotive electronic controls; component-level problems; computation times; computational fluid-dynamic models; cycle time reduction values; finite-volume grids; grid optimization; lumped RthCth approximations; root-mean-squared current; spatial domain; steady-state approximation; temporal domain; transient analysis solution time; transient load; Computational fluid dynamics; Conductors; Electric resistance; Equations; Heat transfer; Power system modeling; Steady-state; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012442
  • Filename
    1012442