DocumentCode
1845794
Title
Thermal challenges in the future generation solid state lighting applications: light emitting diodes
Author
Arik, Mehmet ; Petroski, James ; Weaver, Stanton
Author_Institution
Corporate Res. & Dev., Gen. Electr. Co., Niskayuna, NY, USA
fYear
2002
fDate
2002
Firstpage
113
Lastpage
120
Abstract
Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the level-1 packages and developments in LED power packaging. The luminous efficiency of LEDs is expected to reach over 80 lumens/watt, that is approximately 6 times more than one tungsten bulb. The thermal challenges of these products in many applications will open new research areas for engineers from chip level to system level thermal management.
Keywords
brightness; light emitting diodes; lighting; semiconductor device packaging; thermal management (packaging); chip level thermal management; electrical currents; general illumination applications; high brightness LEDs; level-1 packages; light emitting diodes; luminous efficiency; solid state lighting applications; system level thermal management; thermal paths; Brightness; Engineering management; Light emitting diodes; Packaging; Power engineering and energy; Power system management; Solid state lighting; Thermal engineering; Thermal management; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012446
Filename
1012446
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