• DocumentCode
    1845794
  • Title

    Thermal challenges in the future generation solid state lighting applications: light emitting diodes

  • Author

    Arik, Mehmet ; Petroski, James ; Weaver, Stanton

  • Author_Institution
    Corporate Res. & Dev., Gen. Electr. Co., Niskayuna, NY, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    113
  • Lastpage
    120
  • Abstract
    Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the level-1 packages and developments in LED power packaging. The luminous efficiency of LEDs is expected to reach over 80 lumens/watt, that is approximately 6 times more than one tungsten bulb. The thermal challenges of these products in many applications will open new research areas for engineers from chip level to system level thermal management.
  • Keywords
    brightness; light emitting diodes; lighting; semiconductor device packaging; thermal management (packaging); chip level thermal management; electrical currents; general illumination applications; high brightness LEDs; level-1 packages; light emitting diodes; luminous efficiency; solid state lighting applications; system level thermal management; thermal paths; Brightness; Engineering management; Light emitting diodes; Packaging; Power engineering and energy; Power system management; Solid state lighting; Thermal engineering; Thermal management; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012446
  • Filename
    1012446