• DocumentCode
    1846180
  • Title

    Validation of models for air cooled plane fin heat sinks used in computer cooling

  • Author

    Saini, Manish ; Webb, Ralph L.

  • Author_Institution
    Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    243
  • Lastpage
    250
  • Abstract
    Plane fin heat sinks, on which a small fan is mounted, are typically used for cooling the CPU in computers. The two most common air-flow configurations are parallel (or duct) flow and impinging flow. A number of analytic, numerical, and semi-empirical models have been published to predict heat sink performance. Most models assume uniform airflow (duct or impinging) at the heat sink inlet. The present work reviews some of the recent and representative models for the two flow configurations. A simple model based on developing laminar flow in rectangular channels is proposed. Experiments were conducted to measure hydraulic and thermal performance of two representative plane fin aluminum heat sinks, one for each flow configuration. The test data are compared with the proposed model for parallel flow and a selected model for impinging flow. A comparison of the proposed duct flow model predictions shows good agreement with the pressure drop and heat transfer data. Similarly good validation of the impinging flow model is established.
  • Keywords
    aluminium; channel flow; cooling; heat sinks; laminar flow; packaging; pipe flow; thermal resistance; air cooled plane fin heat sinks; air-flow configurations; computer cooling; duct flow; heat transfer data; hydraulic performance; impinging flow; laminar flow; parallel flow; plane fin Al heat sinks; pressure drop; rectangular channels; thermal performance; Aluminum; Central Processing Unit; Cooling; Ducts; Fluid flow measurement; Heat sinks; Numerical models; Performance analysis; Predictive models; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012464
  • Filename
    1012464