DocumentCode
1846180
Title
Validation of models for air cooled plane fin heat sinks used in computer cooling
Author
Saini, Manish ; Webb, Ralph L.
Author_Institution
Pennsylvania State Univ., University Park, PA, USA
fYear
2002
fDate
2002
Firstpage
243
Lastpage
250
Abstract
Plane fin heat sinks, on which a small fan is mounted, are typically used for cooling the CPU in computers. The two most common air-flow configurations are parallel (or duct) flow and impinging flow. A number of analytic, numerical, and semi-empirical models have been published to predict heat sink performance. Most models assume uniform airflow (duct or impinging) at the heat sink inlet. The present work reviews some of the recent and representative models for the two flow configurations. A simple model based on developing laminar flow in rectangular channels is proposed. Experiments were conducted to measure hydraulic and thermal performance of two representative plane fin aluminum heat sinks, one for each flow configuration. The test data are compared with the proposed model for parallel flow and a selected model for impinging flow. A comparison of the proposed duct flow model predictions shows good agreement with the pressure drop and heat transfer data. Similarly good validation of the impinging flow model is established.
Keywords
aluminium; channel flow; cooling; heat sinks; laminar flow; packaging; pipe flow; thermal resistance; air cooled plane fin heat sinks; air-flow configurations; computer cooling; duct flow; heat transfer data; hydraulic performance; impinging flow; laminar flow; parallel flow; plane fin Al heat sinks; pressure drop; rectangular channels; thermal performance; Aluminum; Central Processing Unit; Cooling; Ducts; Fluid flow measurement; Heat sinks; Numerical models; Performance analysis; Predictive models; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012464
Filename
1012464
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