Title :
Experiments and modeling of the hydraulic resistance of in-line square pin fin heat sinks with top by-pass flow
Author :
Dogruoz, M. Baris ; Urdaneta, Maryory ; Ortega, Antonio
Author_Institution :
Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
In this paper, we present some early findings from an experimental and analytical study aimed at obtaining physical insight into the behavior of square, in-line pin fin heat sinks. In the experimental study, various size aluminum heat sinks were utilized, where the pin heights were 12.5 mm, 17.5 mm, and 22.5 mm, and the base dimensions were kept fixed at 25 × 25 mm. A "two-branch by-pass model" was developed, in which a one-dimensional differential approach was used to model the fluid flow through the heat sink and its top by-pass duct. Central to the analysis is the introduction of accurate correlations for inlet, exit and core pressure drop within the heat sink. Pressure drop predictions correlated well with the experimental data when pressure drop coefficients measured for the heat sinks were used. Agreement was poorer when classical circular tube bundle pressure drop correlations were utilized, but the accuracy was high enough for design purposes. Inlet and exit pressure losses were as important as the core pressure drop in establishing the overall flow and pressure drop. Available literature models for inlet and exit effects were mostly adequate.
Keywords :
aluminium; cooling; heat sinks; packaging; pipe flow; 12.5 mm; 17.5 mm; 22.5 mm; 25 mm; Al; aluminum heat sinks; base dimensions; circular tube bundle pressure drop correlations; core pressure drop; duct flow analysis; electronics cooling; exit pressure drop; fluid flow model; hydraulic resistance; in-line square pin fin heat sinks; inlet pressure drop; one-dimensional differential approach; pin heights; pressure drop coefficients; top by-pass flow; two-branch by-pass model; Ducts; Electron tubes; Electronic packaging thermal management; Friction; Heat engines; Heat sinks; Heat transfer; Resistance heating; Thermal factors; Thermal force;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012465