DocumentCode :
1846806
Title :
A system design approach to liquid-cooled microprocessors
Author :
Dickinson, Randall D. ; Novotny, Steffen ; Vogel, Marlin ; Dunn, John
Author_Institution :
ThermoNESLAB, Portsmouth, NH, USA
fYear :
2002
fDate :
2002
Firstpage :
413
Lastpage :
420
Abstract :
This paper describes a compact fluid-cooled computer system, comprised of micro-channel heat exchangers, a fan, and a small pump, to remove heat from a microprocessor. Computational fluid dynamic analysis was used to determine the optimal micro-channel fin array design. Normal flow heat exchanger (NFHX) and parallel flow heat exchanger (PFHX) designs were evaluated. Due to packaging constraints, a micro-channel radiator was used. Integral to the radiator design was the selection of a reliable 30 SCFM blower. Fluid flow and pressure requirements were on the order of 0.5 LPM and 4 PSID respectively. The cooling system developed provided a heatsink to air thermal resistance of 0.155°C/W. An understanding was developed of the effect of airflow, liquid-flow, and heatload on the system performance leading to work which would achieve a heatsink to air thermal resistance of 0.100°C/W and lower.
Keywords :
computational fluid dynamics; cooling; heat exchangers; microfluidics; reliability; thermal management (packaging); thermal resistance; air thermal resistance; computational fluid dynamic analysis; cooling; fan; fluid-cooled computer; heat load; heat sink; micro-channel heat exchangers; micro-channel radiator; optimal micro-channel fin array; packaging; parallel flow heat exchanger; pump; pump reliability; radiator design; Computational fluid dynamics; Cooling; Fluid flow; Heat pumps; Microprocessors; Packaging; Resistance heating; System analysis and design; System performance; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012486
Filename :
1012486
Link To Document :
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