Title :
Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks
Author :
Hamdan, Mohammed ; Cytrynowicz, Debra ; Medis, Praveen ; Shuja, Ahmed ; Gerner, Frank M. ; Henderson, H.T. ; Golliher, Eric ; Mellott, Ken ; Moore, Chris
Author_Institution :
Dept. of Mech., Ind., & Nucl. Eng., Cincinnati Univ., OH, USA
Abstract :
This paper introduces a theoretical model for a Loop Heat Pipe (LHP) utilizing a coherent porous silicon (CPS) wick. The paper investigates the effects of different parameters on the performance of the LHP such as evaporator temperature, condenser temperature, total mass charge, wick thickness, porosity, and pore size. A LHP is a two-phase device with extremely high effective thermal conductivity that uses capillary forces developed inside its wicked evaporator to pump a working fluid through a closed loop. The loop heat pipe is developed to efficiently transport heat that is generated by a highly localized concentrated heat source and then to discharge this heat to a convenient sink. This device is urgently needed to cool electronic components, especially in space applications. The LHP has been modeled utilizing the conservation equations and thermodynamic cycle. The loop heat pipe cycle is presented on a T-s diagram. A direct relation is developed between the ratio of heat going for evaporation as well as heat leaking to the compensation chamber.
Keywords :
capillarity; cooling; flow through porous media; fluid oscillations; heat pipes; packaging; porous semiconductors; space vehicle electronics; temperature distribution; Si; capillary forces; closed loop; coherent porous silicon wicks; compensation chamber; condenser temperature; conservation equations; electronic component cooling; evaporator temperature; heat leakage; high effective thermal conductivity; interface oscillation; localized concentrated heat source; loop heat pipe development; model; pore size; porosity; space applications; temperature distribution; thermodynamic cycle; total mass charge; two-phase device; wick thickness; wicked evaporator; working fluid pumping; Electronic components; Equations; Fault location; Heat sinks; Pumps; Silicon; Space cooling; Temperature; Thermal conductivity; Thermal force;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012492