DocumentCode :
1847161
Title :
Modeling large-scale electronic systems using computational fluid dynamics through a "zoom-in" approach
Author :
Gupta, Anurag
Author_Institution :
Flomerics Inc., Southborough, MA, USA
fYear :
2002
fDate :
2002
Firstpage :
495
Lastpage :
500
Abstract :
This paper talks about Computational Fluid Dynamics (CFD) modeling of large-scale electronic systems like telecommunication racks using a "zoom-in" approach. FLOTHERM™ was used as the CFD tool for this work. Zoom-in modeling, a two-step process, involves focusing on a critical element, or a subsystem rather than the whole system. This is much more efficient because such small-scale models are easier to build and troubleshoot, faster to solve, and more accurate. The aim of this paper is to outline the methodology involved in zoom-in modeling using a complex telecommunications rack as the vehicle. First, the telecommunication rack was modeled at the system level using two approaches: (a) representation of detailed boards as bulk resistances to flow with heat dissipation, (b) lumping of components on the board to a few major components. This first-stage analysis led to the identification of a critical board in the system. The second step involved zooming-in on the critical board by modeling it in complete detail using the thermal and flow boundary conditions obtained from the system level model. Finally, a detailed system level model was solved for comparison of the component temperatures and near-component flow details with the zoom-in model results.
Keywords :
computational fluid dynamics; cooling; printed circuit design; telecommunication equipment; CFD modeling; FLOTHERM; airflow altering components; build-time; bulk flow resistances; component temperatures; computational fluid dynamics; critical board; flow boundary conditions; grid requirement; heat dissipating components; heat dissipation; large-scale electronic systems; system level modeling; telecommunication racks; thermal boundary conditions; zoom-in approach; Assembly; Computational fluid dynamics; Cooling; Fans; Large-scale systems; Power supplies; Resistance heating; Solids; Steel; Telecommunications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012497
Filename :
1012497
Link To Document :
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