Title :
Raised floor computer data center: effect on rack inlet temperatures of chilled air exiting both the hot and cold aisles
Author :
Schmidt, Roger ; Cruz, Ethan
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
This paper focuses on the effect of the rack inlet temperatures resulting from chilled air exhausting from perforated tiles situated in both the hot and cold aisles of a raised floor data center. Only the above floor (raised floor) flow and temperature distributions were analyzed for various flowrates exhausting from the perforated tiles. A Computational Fluid Dynamic(CFD) model was generated for the room with electronic equipment installed on a raised floor with particular focus on the effects on rack inlet temperatures of equipment heat load, placement of air conditioning (A/C) units and chilled air flowrates. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide x 13.4 m long. Since the arrangement of the racks in the data center was symmetric only one-half of the data center needed to be modeled. The numerical modeling was performed using a commercially available finite control volume computer code called Flotherm (Trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
Keywords :
air conditioning; computational fluid dynamics; computer centres; finite volume methods; temperature distribution; thermal management (packaging); turbulence; Flotherm; air conditioning; chilled air exhaust; cold aisle; computational fluid dynamic model; data processing; electronic equipment; finite control volume computer code; heat load; hot aisle; k-e turbulence model; numerical simulation; perforated tile; rack inlet temperature; raised floor computer data center; temperature distribution; thermal management; Computational modeling; Data engineering; Data processing; Electronic equipment; Floors; Numerical models; Rapid thermal processing; Temperature distribution; Thermal management; Tiles;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012507