Title :
Broadband Measurement-Based Modeling of Digital Interconnect
Author_Institution :
Department of Information Technology, University of Gent, Sint-Pietersnieuwstraat 41, B-9000 Gent, Belgium Tel.: +32 9 2643333, Fax: +32 9 2643593, e-mail: luc.martens@intec.rug.ac.be
Abstract :
This paper describes a general method to derive broadband SPICE circuit models for digital interconnects and packages. The method starts from measured or simulated S-parameters of the package or interconnects under test. The parameters are extracted with minimal optimization leading to physical values.
Keywords :
Capacitors; Circuit simulation; Connectors; Coupling circuits; Crosstalk; Degradation; Delay; Integrated circuit interconnections; Integrated circuit packaging; Scattering parameters;
Conference_Titel :
ARFTG Conference Digest-Spring, 54th
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1999.327361
