Title :
Gap-reduced thermal paste package design for cooling single flip-chip electronic modules
Author :
Sikka, K.K. ; Toy, H.T. ; Edwards, D.L. ; Iruvanti, S. ; Ingalls, E.M. ; DeHaven, P.W.
Author_Institution :
IBM Microelectron., Hopewell Junction, NY, USA
Abstract :
A method of reducing the thermal paste chip-to-cap interface gap is presented to achieve enhanced cooling of single flip-chip electronic modules. The structure and assembly process steps of the gap reduction design are described. The thermal reliability of the design is evaluated by measuring the thermal resistance for several permutations of the structural design variables, allowing identification of an optimum design configuration.
Keywords :
cooling; flip-chip devices; integrated circuit packaging; modules; thermal resistance; assembly process; chip-to-cap interface gap; electronic cooling; flip-chip electronic module; package design; structural design optimization; thermal paste; thermal reliability; thermal resistance; Assembly; Conducting materials; Electronic packaging thermal management; Electronics cooling; Inorganic materials; Sealing materials; Seals; Thermal conductivity; Thermal loading; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012516
