DocumentCode
1847655
Title
PC Board Characterization Using Accurate Hybrid Probing Techniques
Author
Gross, S. ; Dunleavy, L. ; Weller, T. ; Schmitz, B. ; Winslow, T.
Author_Institution
Wireless and Microwave (WAMI) Program, University of South Florida, Department of Electrical Engineering, 4202 E. Fowler Ave., ENB 118, Tampa, Florida
Volume
36
fYear
2000
fDate
Dec. 2000
Firstpage
1
Lastpage
10
Abstract
A systematic measurement and modeling strategy is described for complete characterization of a printed circuit board comprising a power amplifier circuit. Hybrid wafer probing is used in conjunction with TRL ¿on-board¿ calibration to derive precise characterization data for grounded coplanar waveguide lines as well as lumped surface mount components. Excellent agreement is shown between measurement based lumped component models, and transmission line structures as well as composite matching networks.
Keywords
Calibration; Coplanar waveguides; Power amplifiers; Power measurement; Power system modeling; Printed circuits; Semiconductor device modeling; Surface waves; Transmission line measurements; Waveguide components;
fLanguage
English
Publisher
ieee
Conference_Titel
ARFTG Conference Digest-Spring, 54th
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-5686-1
Type
conf
DOI
10.1109/ARFTG.1999.327372
Filename
4120074
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