DocumentCode :
1847655
Title :
PC Board Characterization Using Accurate Hybrid Probing Techniques
Author :
Gross, S. ; Dunleavy, L. ; Weller, T. ; Schmitz, B. ; Winslow, T.
Author_Institution :
Wireless and Microwave (WAMI) Program, University of South Florida, Department of Electrical Engineering, 4202 E. Fowler Ave., ENB 118, Tampa, Florida
Volume :
36
fYear :
2000
fDate :
Dec. 2000
Firstpage :
1
Lastpage :
10
Abstract :
A systematic measurement and modeling strategy is described for complete characterization of a printed circuit board comprising a power amplifier circuit. Hybrid wafer probing is used in conjunction with TRL ¿on-board¿ calibration to derive precise characterization data for grounded coplanar waveguide lines as well as lumped surface mount components. Excellent agreement is shown between measurement based lumped component models, and transmission line structures as well as composite matching networks.
Keywords :
Calibration; Coplanar waveguides; Power amplifiers; Power measurement; Power system modeling; Printed circuits; Semiconductor device modeling; Surface waves; Transmission line measurements; Waveguide components;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Spring, 54th
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1999.327372
Filename :
4120074
Link To Document :
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