• DocumentCode
    1847655
  • Title

    PC Board Characterization Using Accurate Hybrid Probing Techniques

  • Author

    Gross, S. ; Dunleavy, L. ; Weller, T. ; Schmitz, B. ; Winslow, T.

  • Author_Institution
    Wireless and Microwave (WAMI) Program, University of South Florida, Department of Electrical Engineering, 4202 E. Fowler Ave., ENB 118, Tampa, Florida
  • Volume
    36
  • fYear
    2000
  • fDate
    Dec. 2000
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    A systematic measurement and modeling strategy is described for complete characterization of a printed circuit board comprising a power amplifier circuit. Hybrid wafer probing is used in conjunction with TRL ¿on-board¿ calibration to derive precise characterization data for grounded coplanar waveguide lines as well as lumped surface mount components. Excellent agreement is shown between measurement based lumped component models, and transmission line structures as well as composite matching networks.
  • Keywords
    Calibration; Coplanar waveguides; Power amplifiers; Power measurement; Power system modeling; Printed circuits; Semiconductor device modeling; Surface waves; Transmission line measurements; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 54th
  • Conference_Location
    Atlanta, GA, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1999.327372
  • Filename
    4120074