DocumentCode :
1847765
Title :
Controlling air recirculation in multi-processor systems
Author :
Bruns, Chad ; Sundaram, Sridhar
Author_Institution :
Adv. Micro Devices Inc., Austin, TX, USA
fYear :
2002
fDate :
2002
Firstpage :
705
Lastpage :
709
Abstract :
With the increased popularity of multi-processor systems and ever-increasing power requirements, the problem of preventing re-circulation of preheated air is becoming more important to consider in system-level designs. For the common setup of a desktop tower chassis with two impingement-cooled heat sinks and one or more system fans, the problem is that pre-heated air exiting the heat sink from the upstream processor can cause a significant rise in the intake temperature for the other processor. For many systems, temperature rises of up to 10 degrees were observed for the rear processor over the front one, all other factors being equal. Air deflectors were designed with the goal of controlling this problem in multiprocessor systems. They have been optimized and tested through experiments. The effect of these devices was that the temperature of the downstream processor dropped by 68 degrees in most cases, and there is usually a smaller effect on the temperature of the upstream processor. Consequently, higher speed processors could be supported without major changes to chassis, system layout, or heat sink cost. This method could be applicable not only to computer processors, but to general convection-cooled systems with multiple heat sources.
Keywords :
computational fluid dynamics; cooling; forced convection; heat sinks; multiprocessing systems; thermal management (packaging); thermal resistance; air recirculation control; chassis designs; convection-cooled systems; die temperatures; heat sink; multiprocessor systems; preheating; system fans; system-level designs; thermal resistance; upstream processor; wind funnel; Cogeneration; Computational fluid dynamics; Computational modeling; Computer simulation; Control systems; Heat sinks; System-level design; Temperature measurement; Thermal resistance; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012524
Filename :
1012524
Link To Document :
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