Title :
A CFD analysis of an electronic box
Author_Institution :
Thermal Consultant, Dallas, TX, USA
Abstract :
A sealed extruded housing includes two racks and each rack contains six printed circuit boards. Two fans are installed on one of the boards, namely the fan card, in each rack. The airflow circulation created by the fans will remove the heat generated from the components on the boards. Heat is further transferred from the circulated air to the housing walls by convection and is finally dumped to the ambient by convection and radiation. A CFD analysis is performed to evaluate the proposed cooling scheme of using a fan card to cool the printed, circuit boards within the rack.
Keywords :
computational fluid dynamics; forced convection; heat sinks; printed circuits; temperature distribution; thermal management (packaging); CFD analysis; airflow circulation; convection; cooling scheme; electronic box; fan card; flow fields; heat dissipation; printed circuit boards; sealed extruded housing; temperature fields; Aluminum; Assembly; Computational fluid dynamics; Cooling; Fans; Heat transfer; Performance analysis; Performance evaluation; Printed circuits; Temperature;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012525
