Title :
A new surface mount power package
Author :
Ehnert, Alexander ; Sukumar, Vajapeyam ; Diot, Jean-Luc
Author_Institution :
SGS-Thomson Microelectron., Catania, Italy
Abstract :
A new surface mount power package is introduced. This power package is designed from the start with surface mounting in mind. It is suitable for all reflow soldering methods. The main advantages of the package are excellent thermal performance, high power capability and high power density, versatility and thermally efficient and reliable soldering. It is shown that the new PowerSO-10 is a perfect successor to the TO-220 package for the surface mount technology (SMT) environment
Keywords :
power integrated circuits; soldering; surface mount technology; PowerSO-10; SMT; power IC; power capability; power density; reflow soldering methods; reliability; surface mount power package; thermal efficiency; thermal performance; versatility; Assembly; Automotive engineering; Circuits; Diodes; Electronic packaging thermal management; Electronics packaging; Microelectronics; Power transistors; Reflow soldering; Surface-mount technology;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1993. APEC '93. Conference Proceedings 1993., Eighth Annual
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0983-9
DOI :
10.1109/APEC.1993.290688
