DocumentCode
1847967
Title
A new surface mount power package
Author
Ehnert, Alexander ; Sukumar, Vajapeyam ; Diot, Jean-Luc
Author_Institution
SGS-Thomson Microelectron., Catania, Italy
fYear
1993
fDate
7-11 Mar 1993
Firstpage
380
Lastpage
384
Abstract
A new surface mount power package is introduced. This power package is designed from the start with surface mounting in mind. It is suitable for all reflow soldering methods. The main advantages of the package are excellent thermal performance, high power capability and high power density, versatility and thermally efficient and reliable soldering. It is shown that the new PowerSO-10 is a perfect successor to the TO-220 package for the surface mount technology (SMT) environment
Keywords
power integrated circuits; soldering; surface mount technology; PowerSO-10; SMT; power IC; power capability; power density; reflow soldering methods; reliability; surface mount power package; thermal efficiency; thermal performance; versatility; Assembly; Automotive engineering; Circuits; Diodes; Electronic packaging thermal management; Electronics packaging; Microelectronics; Power transistors; Reflow soldering; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1993. APEC '93. Conference Proceedings 1993., Eighth Annual
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0983-9
Type
conf
DOI
10.1109/APEC.1993.290688
Filename
290688
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