DocumentCode
1848011
Title
Coifman wavelets in 3D scattering from very rough surfaces
Author
Pan, G.W. ; Ke Wang ; Gilbert, T.K.
Author_Institution
Arizona State Univ., Tempe, AZ, USA
Volume
3
fYear
2003
fDate
22-27 June 2003
Firstpage
400
Abstract
Scattering of electromagnetic waves from rough surfaces has been studied by analytical, experimental, and numerical means. In the numerical approaches, the Monte Carlo method has been used for decades employing the method of moments (MoM). Traditional MoM in conjunction with the Galerkin procedure requires that the computation time be on the order of n/sup 2/ for matrix filling and n/sup 3/ for matrix inversion if Gaussian elimination is employed. In this paper we employ the Coifman wavelets (Coiflets) which have compact supports, permit the multiresolution analysis (MRA) and form an orthonormal basis with zero moments, smoothness, and Dirac-/spl delta/-like property. The Coiflets reduce the matrix filling into O(n). In a benchmark case of a very rough surface with /spl sigma/ = 1/spl lambda/, /spl lscr/ = 2/spl lambda/, the matrix size has been reduced from 32,768 /spl times/ 32,768 to 8192 /spl times/ 8192. Numerical results agree well with the laboratory measurements. The backscattering enhancements axe observed for both the like- and crosspolarizations.
Keywords
Galerkin method; backscatter; electromagnetic wave scattering; magnetic field integral equations; method of moments; rough surfaces; wavelet transforms; 3D scattering; Coifman scaling functions; Coifman wavelets; Galerkin procedure; backscattering enhancements; electromagnetic waves; magnetic field integral equation; method of moments; multiresolution analysis; orthonormal basis; smoothness; very rough surfaces; zero moments; Electromagnetic analysis; Electromagnetic scattering; Filling; Laboratories; Moment methods; Multiresolution analysis; Rough surfaces; Surface roughness; Surface waves; Wavelet analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location
Columbus, OH, USA
Print_ISBN
0-7803-7846-6
Type
conf
DOI
10.1109/APS.2003.1219871
Filename
1219871
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