DocumentCode
1848365
Title
Relating sinusoid to random vibration for electronic packaging testing
Author
Wang, Frank Fan
Author_Institution
Eldec Co., Lynnwood, WA, USA
fYear
2002
fDate
2002
Firstpage
892
Lastpage
895
Abstract
There are two acceptable exercises of evaluating the electronics against vibration damage. They are sinusoid vibration, and random vibration testing. The differences of these two tests are obvious. Their characterizations of vibration are based on distinctly different sets of mathematics. This paper will discuss a method to relate one testing result to the other. The method to relate these two testing methods is based on the equivalent damage theory of the electronics packaging. The theory is that if one testing method causes the same kinds of damaging effects as the other testing method, the results can then be related.
Keywords
circuit reliability; dynamic testing; packaging; production testing; spectral analysis; vibrations; differential equation; electrodynamics shaker; electronic packaging testing; equivalent damage theory; mechanical shaker; power spectral density definition; random vibration testing; reliability; sine dwell; sine sweep; sinusoid vibration testing; vibration damage; Acceleration; Damping; Electronic equipment testing; Electronics packaging; Life estimation; Mathematics; Qualifications; Resonance; Resonant frequency; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012549
Filename
1012549
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