• DocumentCode
    1848365
  • Title

    Relating sinusoid to random vibration for electronic packaging testing

  • Author

    Wang, Frank Fan

  • Author_Institution
    Eldec Co., Lynnwood, WA, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    892
  • Lastpage
    895
  • Abstract
    There are two acceptable exercises of evaluating the electronics against vibration damage. They are sinusoid vibration, and random vibration testing. The differences of these two tests are obvious. Their characterizations of vibration are based on distinctly different sets of mathematics. This paper will discuss a method to relate one testing result to the other. The method to relate these two testing methods is based on the equivalent damage theory of the electronics packaging. The theory is that if one testing method causes the same kinds of damaging effects as the other testing method, the results can then be related.
  • Keywords
    circuit reliability; dynamic testing; packaging; production testing; spectral analysis; vibrations; differential equation; electrodynamics shaker; electronic packaging testing; equivalent damage theory; mechanical shaker; power spectral density definition; random vibration testing; reliability; sine dwell; sine sweep; sinusoid vibration testing; vibration damage; Acceleration; Damping; Electronic equipment testing; Electronics packaging; Life estimation; Mathematics; Qualifications; Resonance; Resonant frequency; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012549
  • Filename
    1012549