DocumentCode :
1848464
Title :
Non-linear Modeling of a Multi-FET Multi-Port IC
Author :
Grinbergs, O. ; Dunleavy, L. ; Gross, S. ; Schmitz, B. ; Winslow, T.
Author_Institution :
Wireless and Microwave (WAMI) Program, Department of Electrical Engineering, University of South Florida, 4202 E. Fowler Ave., ENB 118, Tampa, Florida
Volume :
37
fYear :
2000
fDate :
15-16 June 2000
Firstpage :
1
Lastpage :
7
Abstract :
A method is presented for developing a large-signal MESFET model for a compact multi-FET and multiport GaAs IC, which is employed in a 2 GHz hybrid power amplifier. The approach employs Agilent (formerly HP) EEsof??s IC-CAP?? computer-aided measurement acquisition and parameter extraction software. IC-CAP is used to develop conventional Curtice Cubic MESFET models for the constituent FETs. The interesting aspects of the work are the multi-port nature of the IC, and the inability to derive suitable device characterization measurements directly from the multi-FET IC. Our approach was to model individual ??dropout?? devices that are similar, though not identical to, the devices comprising the IC. The composite multi-FET non-linear model has more than six accessible ports to which, ground connections, package parasitics, biasing and matching networks are connected to enable simulation of the entire power amplifier. Individual FET model parameters are extracted from swept DC and small-signal S-parameter measurements. Linear transformations and regression algorithms within the IC-CAP software facilitate parameter extraction. Measurements and subsequent large-signal models were made of three individual MESFET devices, with gate widths of 300??m, 1200??m and 7200??m, representative of those that comprise the MMIC power amplifier. Additional measurement challenges included the relatively high power output, and current of the largest FET device. Exploration of accuracy and limitations of the non-linear models was carried out with linear and non-linear measurement and model comparisons.
Keywords :
FETs; Gallium arsenide; Hybrid integrated circuits; Integrated circuit modeling; Integrated circuit packaging; MESFET integrated circuits; Parameter extraction; Power amplifiers; Power measurement; Software measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Spring, 55th
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.2000.327416
Filename :
4120108
Link To Document :
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