Accelerated reliability predictions-thermomechanical fatigue solder joints methodology

Author

Strifas, Nick ; Vaughan, Chris ; Ruzzene, Massimo

Author_Institution

Dahlgren Div. Code G53, Naval Surface Warfare Center, Dahlgren, VA, USA

fYear

2002

fDate

2002

Firstpage

974

Lastpage

978

Abstract

A generalized finite element based approach for estimating the reliability of solder joint for surface mount packages is presented in this study. The methodology is based on the viscoplastic constitutive law for the solder response and the crack growth rate model for solder joint fatigue. An accelerated life prediction model is developed for eutectic Sn-Pb solder joints assuming a two-parameter Weibull failure distribution.

Keywords

circuit reliability; failure analysis; fatigue cracks; finite element analysis; soldering; surface mount technology; thermal stress cracking; SMT; Sn-Pb; accelerated life prediction model; accelerated reliability predictions; crack growth rate model; eutectic Sn-Pb solder joints; generalized finite element based approach; solder joint fatigue; solder joint reliability estimation; solder response; surface mount packages; thermomechanical fatigue; two-parameter Weibull failure distribution; viscoplastic constitutive law; Acceleration; Assembly; Capacitive sensors; Circuit testing; Degradation; Fatigue; Life estimation; Soldering; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on

ISSN

1089-9870

Print_ISBN

0-7803-7152-6

Type

conf

DOI

10.1109/ITHERM.2002.1012562

Filename

1012562