DocumentCode
1848693
Title
Experimental study of failure mechanisms in particle filled acrylic composites
Author
Basaran, Cemal ; Nie, Shihua ; Hutchins, Clyde S.
Author_Institution
Dept. of Civil, Struct. & Environ. Eng., State Univ. of New York, Buffalo, NY, USA
fYear
2002
fDate
2002
Firstpage
979
Lastpage
986
Abstract
Particle filled solid surface composites are used to fabricate kitchen countertops and sinks which may be subjected to severe temperature variations, giving rise to high thermal stresses. These stresses may lead to failure by cracking in regions subjected to large temperature variation. An aim of this paper is to investigate mechanisms of failure in solid surface materials using in situ observations during tensile, compressive and fatigue loading and to define test configurations that give meaningful measurements of material properties. Experiments show that the failure in tension occurs in several stages. In flexural loading the failure process is more complex. Consequently, flexural testing should not be used as a substitute for the measurement of ultimate tensile strength in a particle filled solid surface composite. The application of conventional damage mechanics to describe the failure of test specimens is also discussed.
Keywords
brittle fracture; failure analysis; fatigue; filled polymers; particle reinforced composites; tensile strength; thermal stress cracking; thermal stresses; brittle materials; compressive loading; cracking; damage mechanics; failure mechanisms; fatigue loading; flexural loading; high thermal stresses; in situ observations; kitchen countertops; kitchen sinks; material properties; particle filled acrylic composites; particulate composites; severe temperature variations; solid surface composites; tensile loading; tensile strength; test configurations; Compressive stress; Failure analysis; Fatigue; Material properties; Materials testing; Solids; Surface cracks; Temperature; Tensile stress; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012563
Filename
1012563
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