Thermal considerations for distributed power converter systems

Author

Ridley, Ray ; Reynell, Michael ; Kern, Siegfried

Author_Institution

Ridley Eng., Battle Creek, MI, USA

fYear

1993

fDate

7-11 Mar 1993

Firstpage

866

Lastpage

872

Abstract

Thermal design examples are presented for typical DC-DC systems. A three-dimensional thermal modeling tool is used to predict temperature rise. The simulations presented show that great care must be taken in accurately modeling or thermally testing even a simple power system such as the single DC-DC converter on a PC board. When natural convection cooling is used, the temperature changes can be very counter-intuitive. Software for predicting temperature profiles can be a powerful design aid for reducing wasted experimental effort and laboratory testing

Keywords

cooling; electronic engineering computing; packaging; power convertors; printed circuits; PC board; distributed power converter systems; natural convection cooling; single DC-DC converter; software; temperature rise prediction; thermal considerations; three-dimensional thermal modeling tool; Cooling; DC-DC power converters; Frequency; Heat sinks; Packaging; Power supplies; Power system modeling; Power system reliability; Predictive models; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1993. APEC '93. Conference Proceedings 1993., Eighth Annual

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0983-9

Type

conf

DOI

10.1109/APEC.1993.290729

Filename

290729