DocumentCode :
184982
Title :
Preliminary results on identification of an electro-thermal model for low temperature and high power operation of cylindrical double layer ultracapacitors
Author :
Parvini, Yasha ; Siegel, Jason B. ; Stefanopoulou, Anna G. ; Vahidi, Ardalan
Author_Institution :
Dept. of Mech. Eng., Clemson Univ., Clemson, SC, USA
fYear :
2014
fDate :
4-6 June 2014
Firstpage :
242
Lastpage :
247
Abstract :
The capability of ultracapacitors in delivering high power at low temperature applications such as cold starting is the motivation of this paper. A two state equivalent electric circuit model coupled with a two state thermal model is defined and parameterized to develop a four state control oriented electro-thermal model for cylindrical double layer ultracapacitors. The proposed two state equivalent electric circuit model mimics the terminal voltage dynamics and could be used to evaluate the power capability and efficiency of the cell. The electric model parameters are estimated by pulse-relaxation tests for sub-zero temperatures as low as -40 °C. The two state thermal model provides a tool to estimate the surface and core temperature dynamics. The two models are then coupled through the reversible plus irreversible heat generation and also via temperature dependence of the equivalent circuit model parameters. The modeled terminal voltage and surface temperature dynamics are in good agreement with experimental observations for fixed environmental temperature with forced air cooling.
Keywords :
equivalent circuits; supercapacitors; core temperature dynamics; cylindrical double layer ultracapacitors; electric model parameters; electro-thermal model; equivalent electric circuit model; four state control oriented model; high power operation; irreversible heat generation; low temperature operation; pulse-relaxation tests; sub-zero temperatures; surface temperature dynamics; terminal voltage dynamics; two state thermal model; Computational modeling; Heating; Integrated circuit modeling; Supercapacitors; System-on-chip; Temperature dependence; Temperature distribution; Identification; Modeling and simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
American Control Conference (ACC), 2014
Conference_Location :
Portland, OR
ISSN :
0743-1619
Print_ISBN :
978-1-4799-3272-6
Type :
conf
DOI :
10.1109/ACC.2014.6859394
Filename :
6859394
Link To Document :
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