• DocumentCode
    1850892
  • Title

    A robust DOA estimation algorithm for uniform linear array in the presence of mutual coupling

  • Author

    Wang Bu-hong ; Wang Yong-liang ; Chen Hui

  • Author_Institution
    Key Res. Lab, Wuhan Radar Acad., China
  • Volume
    3
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    924
  • Abstract
    It is well known that the mutual coupling between array elements is inversely related to their separation and may be negligible for elements separated by a few wavelengths, and at the same time the coupling between any two equally spaced sensors is approximately the same. Moreover, following the principle of reciprocity, the mutual coupling can always be expressed by a symmetric matrix. Consequently, a banded symmetric Toeplitz matrix provides a satisfactory model for the mutual coupling of ULA (Uniform linear array). In this paper, a robust subspace-based direction-of-arrival (DOA) estimation algorithm in the presence of mutual coupling is proposed for ULA. Based on the banded symmetric Toeplitz matrix model for the mutual coupling of ULA, the new algorithm provides a favorable DOA estimates and exploits no knowledge of the sensor mutual couplings. More importantly, an accurate estimate of mutual coupling matrix can also be achieved simultaneously for array calibration.
  • Keywords
    Toeplitz matrices; array signal processing; covariance matrices; direction-of-arrival estimation; electromagnetic coupling; linear antenna arrays; matrix decomposition; array calibration; banded symmetric Toeplitz matrix model; covariance matrix; eigendecomposition; mutual coupling; robust DOA estimation algorithm; subspace-based estimation algorithm; uniform linear array; Covariance matrix; Degradation; Direction of arrival estimation; Gaussian noise; Multiple signal classification; Mutual coupling; Radar; Robustness; Sensor arrays; Symmetric matrices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1220061
  • Filename
    1220061