Title :
Fast extraction of Somatosensory Evoked Potential based on Second Order Blind Identification
Author :
Hongtao Liu ; Yong Hu ; Chang, C.Q. ; Luk, K.D.K.
Author_Institution :
Univ. of Hong Kong, Hong Kong
Abstract :
Second order blind identification (SOBI) technique is a promising independent component analysis (ICA) method to extract somatosensory evoked potential (SEP). This simulation study focused on SEP extraction from EEG and power-line noise contaminated SEP signals at signal to noise ratio (SNR) of -10 dB and -20 dB. The correlation coefficients between template SEP and SOBI extracted SEP showed significant high similarity (r>0.76) at -10 dB and mild acceptable similarity (r>0.6) at -20 dB EEG contaminated SEP. However, SOBI extracted SEP showed good performance in power-line noise situation to achieve high correlation coefficients with template SEP (r=0.96). The fast extracted SEP showed stable amplitude and latency, which are almost identical with the SEP template. The results suggested that SOBI is an appropriate method to extract SEP from noisy background.
Keywords :
blind source separation; electroencephalography; feature extraction; independent component analysis; medical signal processing; signal denoising; somatosensory phenomena; EEG; ICA method; correlation coefficients; independent component analysis; power-line noise contaminated signals; second order blind identification technique; signal to noise ratio; somatosensory evoked potential extraction; Adaptive filters; Background noise; Blind source separation; Data mining; Independent component analysis; Orthopedic surgery; Parametric statistics; Robustness; Signal to noise ratio; Wavelet transforms; Algorithms; Diagnosis, Computer-Assisted; Electroencephalography; Evoked Potentials, Somatosensory; Humans; Pattern Recognition, Automated; Principal Component Analysis; Reproducibility of Results; Sensitivity and Specificity;
Conference_Titel :
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location :
Lyon
Print_ISBN :
978-1-4244-0787-3
DOI :
10.1109/IEMBS.2007.4353580