• DocumentCode
    1851384
  • Title

    A Franco-American cooperative design of VAMP avionics modules

  • Author

    Noel, P. ; Schelling, E.R.

  • Author_Institution
    Dassault Electron., Saint Cloud, France
  • fYear
    1993
  • fDate
    24-28 May 1993
  • Firstpage
    751
  • Abstract
    A cooperative program has been undertaken since 1989 between Westinghouse Electric Corporation and Dassault Electronique, through a Memorandum of Understanding (MOU) agreed upon by USAF and DGA (French DoD). This joint effort has been carried out under the VHSIC Avionics Modular Processor (VAMP) program. The goal was the development of three advanced avionic modules for the French DoD´s and USAF´s programs: PMF, a 32-bit military processor originally developed for different uses (Avionics, Navy, Army); NVM module, non-volatile memory (8 mbytes EEPROM); HSDB module, bus interface unit for the High Speed Data Bus (Referring to the AS 4074 Linear Token Passing Bus (LTPB) standard). This effort aims at establishing a high degree of interoperability for future NATO systems. These modules were designed under an equally balanced program in which studies and development were to be shared. The paper outlines the key technical issues in the development of each of these modules. It shows also how these modules are integrated and used in the Wright Laboratory Integrated Test Bed and what could be an associated future development
  • Keywords
    EPROM; VLSI; aircraft instrumentation; integrated memory circuits; microprocessor chips; military computing; military systems; network interfaces; protocols; standards; 32 bit; AS 4074 Linear Token Passing Bus; Army; DGA; Dassault Electronique; EEPROM; Franco-American cooperative design; French DoD; High Speed Data Bus; NATO; NVM module; Navy; PMF; USAF; VAMP avionics modules; VHSIC Avionics Modular Processor; Westinghouse Electric Corporation; Wright Laboratory Integrated Test Bed; bus interface; military processor; nonvolatile memory; Aerospace electronics; Coprocessors; EPROM; Integrated circuit technology; Manufacturing; Military standards; Nonvolatile memory; Packaging; Transport protocols; Very high speed integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1993. NAECON 1993., Proceedings of the IEEE 1993 National
  • Conference_Location
    Dayton, OH
  • Print_ISBN
    0-7803-1295-3
  • Type

    conf

  • DOI
    10.1109/NAECON.1993.290847
  • Filename
    290847