DocumentCode :
1851592
Title :
Heat generation and temperature distribution in DC metallized polymer film capacitors
Author :
Lee, Y.P. ; Kong, M.G.
Author_Institution :
Dept. of Electron. & Electr. Eng., Loughborough Univ., UK
fYear :
2001
fDate :
2001
Firstpage :
669
Lastpage :
672
Abstract :
It is known that elevated temperature can considerably reduce the life expectancy of metallized polymer film capacitors. For film capacitors in service, both the application of a time-varying external voltage and the extinction of internal breakdown events can deposit significant heat onto the capacitor structure leading to an undesirable temperature rise. Often such heat generation is also localized spatially and the resulting temperature gradient enhances the probability of subsequent breakdowns. To gain an understanding, a numerical model is developed to simulate the dynamics of heat generation and transfer under the switching impact of an external DC voltage. Thermal processes in the solids (polymer layers, electrode coating and zinc-sprayed segment) are modelled with a conduction mechanism, whereas a convection mechanism is considered for silicone oil and air. Heat generation is induced by ohmic losses of the externally applied electric field, which can be calculated from an equivalent circuit model recently developed for metallized film capacitors. Thus the heat transfer model interfaces with the equivalent circuit based field calculation model. Based on this electrothermal model, numerical examples are used to study the temperature distribution within film capacitors and then to examine the likelihood of localized temperature hot-spots that may lead to spatially preferential breakdowns
Keywords :
ageing; convection; electric breakdown; equivalent circuits; heat conduction; polymer films; thin film capacitors; DC metallized polymer film capacitors; Zn; conduction mechanism; convection mechanism; electrothermal model; equivalent circuit based field calculation model; equivalent circuit model; heat generation; heat transfer; internal breakdown events; life expectancy; localized temperature hot-spots; ohmic losses; spatially preferential breakdowns; temperature distribution; temperature gradient; thermal processes; time-varying external voltage effects; Breakdown voltage; Capacitors; DC generators; Electric breakdown; Equivalent circuits; Heat transfer; Metallization; Numerical models; Polymer films; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2001 Annual Report. Conference on
Conference_Location :
Kitchener, Ont.
Print_ISBN :
0-7803-7053-8
Type :
conf
DOI :
10.1109/CEIDP.2001.963634
Filename :
963634
Link To Document :
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