DocumentCode
1851694
Title
A fast rescheduling method in semiconductor manufacturing allowing for tardiness and scheduling stability
Author
Cheng, Mingang ; Sugi, Masao ; Ota, Jun ; Yamamoto, Masashi ; Ito, Hiroki ; Inoue, Kazuyoshi
Author_Institution
Dept. of Precision Eng., Tojyo Univ., Tokyo
fYear
2006
fDate
8-10 Oct. 2006
Firstpage
100
Lastpage
105
Abstract
In semiconductor manufacturing, rescheduling problems are extremely difficult to solve in real time due to the high frequency of disturbances that occur approximately every minute. This paper proposes a new approach to online manufacturing rescheduling. Unlike the traditional methods to have a scheduling process again, we (1) revise the existing schedule to keep high schedule stability based on message passing rescheduling with operation sorting; and (2) during the manufacturing process, improve the performance of the revised schedule with the introduction of a quick local search on semi-critical paths. In actual problems with about 200,000 processes, this method can effectively accommodate disturbances in less than 1 second, and a better schedule can be obtained in less than 1 minute. This method has been demonstrated to be more effective than conventional dispatching-rule methods, some of which have been actually applied in many facilities, because it offers higher schedule stability and fewer violations of due dates
Keywords
message passing; production control; scheduling; search problems; semiconductor device manufacture; fast rescheduling method; message passing rescheduling; online manufacturing rescheduling; operation sorting; quick local search; scheduling stability; semi-critical paths; semiconductor manufacturing; tardiness; Computer aided manufacturing; Job shop scheduling; Manufacturing automation; Manufacturing processes; Mathematical programming; Message passing; Processor scheduling; Production facilities; Semiconductor device manufacture; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Automation Science and Engineering, 2006. CASE '06. IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0310-3
Electronic_ISBN
1-4244-0311-1
Type
conf
DOI
10.1109/COASE.2006.326862
Filename
4120328
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