DocumentCode :
1851694
Title :
A fast rescheduling method in semiconductor manufacturing allowing for tardiness and scheduling stability
Author :
Cheng, Mingang ; Sugi, Masao ; Ota, Jun ; Yamamoto, Masashi ; Ito, Hiroki ; Inoue, Kazuyoshi
Author_Institution :
Dept. of Precision Eng., Tojyo Univ., Tokyo
fYear :
2006
fDate :
8-10 Oct. 2006
Firstpage :
100
Lastpage :
105
Abstract :
In semiconductor manufacturing, rescheduling problems are extremely difficult to solve in real time due to the high frequency of disturbances that occur approximately every minute. This paper proposes a new approach to online manufacturing rescheduling. Unlike the traditional methods to have a scheduling process again, we (1) revise the existing schedule to keep high schedule stability based on message passing rescheduling with operation sorting; and (2) during the manufacturing process, improve the performance of the revised schedule with the introduction of a quick local search on semi-critical paths. In actual problems with about 200,000 processes, this method can effectively accommodate disturbances in less than 1 second, and a better schedule can be obtained in less than 1 minute. This method has been demonstrated to be more effective than conventional dispatching-rule methods, some of which have been actually applied in many facilities, because it offers higher schedule stability and fewer violations of due dates
Keywords :
message passing; production control; scheduling; search problems; semiconductor device manufacture; fast rescheduling method; message passing rescheduling; online manufacturing rescheduling; operation sorting; quick local search; scheduling stability; semi-critical paths; semiconductor manufacturing; tardiness; Computer aided manufacturing; Job shop scheduling; Manufacturing automation; Manufacturing processes; Mathematical programming; Message passing; Processor scheduling; Production facilities; Semiconductor device manufacture; Stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Automation Science and Engineering, 2006. CASE '06. IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0310-3
Electronic_ISBN :
1-4244-0311-1
Type :
conf
DOI :
10.1109/COASE.2006.326862
Filename :
4120328
Link To Document :
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