DocumentCode :
1852283
Title :
An overview of the VSPA semiconductor package
Author :
Portuondo, Maria M.
fYear :
1995
fDate :
21-23 Jun 1995
Firstpage :
289
Lastpage :
300
Abstract :
The author presents a brief overview of VSPA characteristics including materials technology, wire routing layout, three tier wire bonding, pre-fab assembly, the surface mount package for multichip modules, packaging real estate, and performance characteristics
Keywords :
Semiconductor device packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electro/95 International. Professional Program Proceedings.
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-2633-4
Type :
conf
DOI :
10.1109/ELECTR.1995.471033
Filename :
471033
Link To Document :
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