DocumentCode :
1852776
Title :
An uncooled microcantilever IR detector based on bulk silicon technique
Author :
Yi, Yuliang ; Yu, Xiaomei ; Xu, Wenhua ; Liu, Ming ; Dong, Liquan ; Liu, Xiaohua ; Zhao, Andi ; Zhao, Yuejin
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
485
Lastpage :
488
Abstract :
This paper presents an uncooled microcantilever infrared (IR) detector, of which the focal plane array (FPA) is fabricated based on bulk silicon technique. Compared with conventional cantilever IR detector fabricated with surface micromachining method, the IR absorption efficiency can be improved by 48% due to the selective removal of the substrate silicon with deep reactive ion etching (DRIE) technique at the area where each FPA pixel is located, and hence the noise equivalent temperature difference (NETD) can be decreased by 32%. Human body´s images were captured by the fabricated FPA at room temperature with an optical readout system. The thermo-mechanical sensitivity of the FPA pixel was measured to be 0.12 mu/K and the NETD of the IR detector was 310 mK. The image quality was improved by post image processing technique.
Keywords :
cantilevers; elemental semiconductors; focal planes; infrared detectors; micromachining; micromechanical devices; silicon; sputter etching; IR absorption efficiency; Si; bulk silicon technique; deep reactive ion etching technique; focal plane array; human body images; image quality; infrared detector; noise equivalent temperature difference; optical readout system; post image processing technique; surface micromachining method; temperature 293 K to 298 K; temperature 310 mK; thermomechanical sensitivity; uncooled microcantilever IR detector; Electromagnetic wave absorption; Etching; Humans; Infrared detectors; Micromachining; Optical noise; Particle beam optics; Sensor arrays; Silicon; Temperature sensors; DRIE; IR detector; bimaterial; cantilever;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285456
Filename :
5285456
Link To Document :
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