DocumentCode :
1853311
Title :
20% Efficient screen-printed and aluminum-alloyed back-contact back-junction cells and interconnection scheme of point-shaped metalized cells
Author :
Woehl, R. ; Keding, R. ; Rüdiger, M. ; Gentischer, H. ; Clement, F. ; Wilde, J. ; Biro, D.
Author_Institution :
Fraunhofer Inst. for Solar Energy Syst. (ISE), Freiburg, Germany
fYear :
2011
fDate :
19-24 June 2011
Abstract :
A back-contact back-junction silicon solar cell is presented that was exclusively structured and metalized by screen-printing technology. On n-type base material the emitter was formed by locally printed and alloyed aluminum structures in a co-firing process. By a varying emitter coverage on the rear the influence on the collection probability and thus the short-circuit current density is analyzed by light beam induced current (LBIC) measurements. Efficiencies of up to 20% were realized and independently confirmed by Fraunhofer ISE CalLab. Two-dimensional simulations of the cell structure are performed and agree well with the processed cell. Variations of several parameters show room for further efficiency increase. Furthermore a new module concept for back-contact cells is presented where the metallization on cell level is point-shaped. The lateral conductance of collected carriers is enabled on module level by a structured printed circuit board. On the contacts an adhesive agent is screen-printed in order to make the aluminum contacts solderable. Afterwards a soldering paste is screen-printed which connects the cell and the printed circuit board or foil during a reflow process. This concept overcomes the restriction in cell size of back-contact back-junction modules due to thick copper layer.
Keywords :
OBIC; adhesives; aluminium alloys; current density; electrical contacts; metallisation; printed circuits; reflow soldering; semiconductor junctions; short-circuit currents; solar cells; Al; Fraunhofer ISE CalLab; LBIC measurements; adhesive agent; aluminum-alloyed back-contact back-junction silicon solar cells; cell size; cell structure; co-firing process; collection probability; emitter coverage; interconnection scheme; lateral conductance; light beam induced current measurements; n-type base material; point-shaped metalized cells; screen-printed back-junction cells; screen-printing technology; short-circuit current density; soldering paste; soldering reflow process; structured printed circuit board; two-dimensional simulations; Aluminum; Copper; Photovoltaic cells; Silicon; Temperature measurement; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6185843
Filename :
6185843
Link To Document :
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