• DocumentCode
    1853483
  • Title

    Biocompatibility and wettability of crystalline SiC and Si surfaces

  • Author

    Coletti, C. ; Jaroszeski, M.J. ; Pallaoro, A. ; Hoff, A.M. ; Iannotta, S. ; Saddow, S.E.

  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    5849
  • Lastpage
    5852
  • Abstract
    Crystalline silicon carbide (SiC) and silicon (Si) biocompatibility was evaluated by directly culturing three mammalian cell lines on these semiconducting substrates. Cell proliferation and adhesion quality were studied using MTT [3- (4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide] assays and fluorescent microscopy. The reported results show that SiC is indeed a more biocompatible substrate than Si. The surface wettability of SiC and Si samples was evaluated through static contact angle measurements, which provided interesting information regarding the influence of different cleaning procedures on the SiC surfaces. The cell proliferation data are discussed in light of the contact angle measurements results. This joint analysis leads to interesting conclusions that may help to uncover the main factors that define a semiconductor´s biocompatibility.
  • Keywords
    adhesion; biomedical materials; cellular biophysics; silicon; silicon compounds; substrates; wetting; 3- (4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide] assays; Si; SiC; adhesion; biocompatibility; cell proliferation; contact angle measurements; crystalline surfaces; fluorescent microscopy; mammalian cell lines; semiconducting substrates; wettability; Adhesives; Cleaning; Crystallization; Fluorescence; Goniometers; Lead compounds; Microscopy; Semiconductivity; Silicon carbide; Substrates; Animals; Biocompatible Materials; Carbon Compounds, Inorganic; Cell Line; Cell Survival; Crystallization; Humans; Materials Testing; Mice; Silicon; Silicon Compounds; Wettability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353678
  • Filename
    4353678