DocumentCode :
1853483
Title :
Biocompatibility and wettability of crystalline SiC and Si surfaces
Author :
Coletti, C. ; Jaroszeski, M.J. ; Pallaoro, A. ; Hoff, A.M. ; Iannotta, S. ; Saddow, S.E.
fYear :
2007
fDate :
22-26 Aug. 2007
Firstpage :
5849
Lastpage :
5852
Abstract :
Crystalline silicon carbide (SiC) and silicon (Si) biocompatibility was evaluated by directly culturing three mammalian cell lines on these semiconducting substrates. Cell proliferation and adhesion quality were studied using MTT [3- (4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide] assays and fluorescent microscopy. The reported results show that SiC is indeed a more biocompatible substrate than Si. The surface wettability of SiC and Si samples was evaluated through static contact angle measurements, which provided interesting information regarding the influence of different cleaning procedures on the SiC surfaces. The cell proliferation data are discussed in light of the contact angle measurements results. This joint analysis leads to interesting conclusions that may help to uncover the main factors that define a semiconductor´s biocompatibility.
Keywords :
adhesion; biomedical materials; cellular biophysics; silicon; silicon compounds; substrates; wetting; 3- (4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide] assays; Si; SiC; adhesion; biocompatibility; cell proliferation; contact angle measurements; crystalline surfaces; fluorescent microscopy; mammalian cell lines; semiconducting substrates; wettability; Adhesives; Cleaning; Crystallization; Fluorescence; Goniometers; Lead compounds; Microscopy; Semiconductivity; Silicon carbide; Substrates; Animals; Biocompatible Materials; Carbon Compounds, Inorganic; Cell Line; Cell Survival; Crystallization; Humans; Materials Testing; Mice; Silicon; Silicon Compounds; Wettability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location :
Lyon
ISSN :
1557-170X
Print_ISBN :
978-1-4244-0787-3
Type :
conf
DOI :
10.1109/IEMBS.2007.4353678
Filename :
4353678
Link To Document :
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