Title : 
Electromagnetic analysis of active radar absorbers
         
        
            Author : 
Kaleeba, P.N. ; Tennant, A. ; Chambers, B. ; Idez, J.P.
         
        
            Author_Institution : 
Dept. of Electron. & Electr. Eng., Univ. of Sheffield, UK
         
        
        
        
        
        
            Abstract : 
The details of an experimental active radar absorber have been presented. The absorber is based on the topology of a Salisbury screen but uses an active impedance layer to provide reflectivity tuning. The active impedance layer is a FSS controlled by semiconductor pin diodes. Measured reflectivity characteristics have been presented and compared to predictions obtained from a simple equivalent circuit transmission line model. The structure has also been analysed using the Ansoft HFSS electromagnetic simulator software in which the diode has been modelled by a small planar slab of material with variable surface impedance. This model provides superior result to the transmission line model in predicting the resonance frequencies of the FSS.
         
        
            Keywords : 
adaptive radar; computational electromagnetics; electromagnetic wave absorption; electromagnetic wave transmission; equivalent circuits; frequency selective surfaces; periodic structures; radar cross-sections; radar equipment; reflectivity; surface impedance; FSS; Salisbury screen; active impedance layer; active radar absorber; bow-tie dipole elements; electromagnetic simulator; equivalent circuit transmission line model; microwave absorbers; periodic structure; rectangular lattice; reflectivity tuning; resonance frequencies; small planar slab; smart radar absorber; variable surface impedance; Circuit optimization; Circuit topology; Distributed parameter circuits; Electromagnetic analysis; Frequency selective surfaces; Impedance; Planar transmission lines; Predictive models; Radar; Reflectivity;
         
        
        
        
            Conference_Titel : 
Antennas and Propagation Society International Symposium, 2003. IEEE
         
        
            Conference_Location : 
Columbus, OH, USA
         
        
            Print_ISBN : 
0-7803-7846-6
         
        
        
            DOI : 
10.1109/APS.2003.1220178