Title :
Transmission and reflection characteristics of a conducting wall with periodic apertures (TE case)
Author_Institution :
Dept. of Electr. Eng., Alabama A&M Univ., Normal, AL, USA
Abstract :
The two-dimensional scattering problem of an electrically conducting (PEC) plane perforated by an infinite array of uniform apertures has been formulated. The problem is transformed to an equivalent one, in which the apertures are covered with electric conductors, and impressed magnetic surface current sources of equal magnitude and opposite polarity are placed on two opposing sides of each conductor. An integral equation for the magnetic current density function is obtained by enforcing the continuity of tangential magnetic field across the apertures, which is subsequently solved using moment method. Computationally efficient formulas for impedance elements have been proposed. Due to periodicity of the structure all elements of the impedance matrix are obtained form a single row. The formulation of this problem can be applied to the electromagnetic characterization of metal studded walls in wireless communication channels.
Keywords :
computational electromagnetics; current density; eigenvalues and eigenfunctions; electromagnetic wave reflection; electromagnetic wave scattering; electromagnetic wave transmission; magnetic field integral equations; method of moments; eigenfunction expansion; electrically conducting plane infinite array; electromagnetic characterization; impressed magnetic surface current sources; integral equation; magnetic current density function; metal studded walls; moment method; periodic apertures; reflection characteristics; time-harmonic transverse electric; transmission characteristics; two-dimensional scattering problem; uniform apertures; wireless communication channels; Apertures; Conductors; Current density; Electromagnetic scattering; Impedance; Integral equations; Magnetic fields; Moment methods; Reflection; Tellurium;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1220181