Failure analysis of NXN pads array using Anisotropic Conductive Films(ACF)

This paper using V-shaped curve method with probability theory to calculate the nxn pads array failure probability of the Anisotropic Conductive Films Packaging. In the conductive (vertical) direction, the Poisson function is used to analyze the opening probability. In the insulation (pitch) direction, the generalized box model is used to analyze the bridging probability. The whole failure probability can be calculated by inclusion-exclusion principal. The results presented in this study suggest that the yield of the ACF package under great pads array number can be improved by decreasing the pad height or choosing the tip volume fraction.