DocumentCode
1854110
Title
A MEMS sensor for mean shear stress measurements in high-speed turbulent flows with backside interconnects
Author
Grady, A.O. ; Larger, R. ; Tiliakos, N. ; Papadopoulos, G. ; Modi, V. ; Fréchette, L.G.
Author_Institution
Mech. Eng. Dept., Columbia Univ., New York, NY, USA
fYear
2009
fDate
21-25 June 2009
Firstpage
272
Lastpage
275
Abstract
A floating-element capacitive MEMS shear stress flow sensor was fabricated and shown to successfully measure mean-turbulent skin friction in high-speed compressible duct flow. The sensor was designed for harsh environments (e.g. high-temperature, high-shear stress) with novel through-substrate interconnects for robust packaging and remote circuitry for capacitance measurement. This paper extends our previous work on the MEMS shear stress sensor design and backside interconnect process development to provide complete device fabrication and testing in a high-speed flow.
Keywords
capacitance measurement; microsensors; stress measurement; turbulence; MEMS sensor; MEMS shear stress sensor design; backside interconnect process development; capacitance measurement; device fabrication; device testing; floating-element capacitive MEMS shear stress flow sensor; harsh environment; high-speed compressible duct flow; high-speed turbulent flow; mean shear stress measurement; mean-turbulent skin friction; robust packaging; through-substrate interconnect; Capacitive sensors; Ducts; Fluid flow measurement; Friction; Integrated circuit interconnections; Micromechanical devices; Packaging; Robustness; Skin; Stress measurement; Capacitive Sensing; MEMS; Shear Stress; Skin Friction; Through Silicon Vias (TSV); Turbulence;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285510
Filename
5285510
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