• DocumentCode
    1854133
  • Title

    Characterization of Au ring microelectrode with cyclic voltammetry and AC impedance spectroscopy

  • Author

    Weixuan Jing ; Fan Zhou ; Lujia Chen ; Zhuangde Jiang ; Lingling Niu ; Bing Wang ; Han Qi

  • Author_Institution
    State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    July 30 2013-Aug. 2 2013
  • Firstpage
    125
  • Lastpage
    127
  • Abstract
    In this paper Au ring microelectrodes are fabricated and characterized. With an optical fibre core as a substrate Au film with thickness 300nm was coated by an electron beam evaporation system, then on this Au coated substrate a parylene passivation layer was deposited, forming the desired Au ring microelectrode. Scanning electron microscopy (SEM) was used to characterize the quality of the deposited films and the adhesion at the interfaces. With a CHI660D electrochemical workstation the electrochemical characterizations were performed at room temperature in a conventional three-electrode system. Cyclic voltammograms as a function of scan rate were sigmoidal form, a typical electrochemical response of microelectrodes. AC impedance frequency spectrum of the fabricated Au ring microelectrode was also obtained in a reversible system, and good agreement was found with the Randels-type equivalent circuit.
  • Keywords
    adhesion; electrochemical impedance spectroscopy; gold; metallic thin films; microelectrodes; scanning electron microscopy; vacuum deposition; voltammetry (chemical analysis); AC impedance frequency spectrum; AC impedance spectroscopy; Au; CHI660D electrochemical workstation; SEM; adhesion; cyclic voltammetry; cyclic voltammograms; electron beam evaporation system; optical fibre core; parylene passivation layer; ring microelectrode; scanning electron microscopy; size 300 nm; temperature 293 K to 298 K; three-electrode system; Fasteners; Films; Fixtures; Gold; Impedance; Microelectrodes; AC impedance frequency spectrum; Cyclic voltammetry; Electron beam evaporation system; Scanning electron microscopy; Vacuum deposition system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Assembly and Manufacturing (ISAM), 2013 IEEE International Symposium on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4799-1656-6
  • Type

    conf

  • DOI
    10.1109/ISAM.2013.6643505
  • Filename
    6643505