Title :
Temperature-insensitive silicon carbide resonant micro-extensometers
Author :
Azevedo, R.G. ; Myers, D.R. ; Pisano, A.P.
Author_Institution :
Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
Abstract :
This work presents thin-film polycrystalline silicon carbide resonant micro-extensometers fabricated on a single-crystalline silicon substrate that are temperature-insensitive near room temperature. The slight difference in thermal expansion coefficient between the device layer and the substrate induces a slight tensile strain near room temperature, which counteracts material softening of the resonator. An analytical model that accounts for these thermal effects predicts that this system will exhibit a turnover temperature near room temperature. A temperature sensitivity of 0.7 Hz/degC (3.6 ppm/degC) from 17 to 65degC is measured experimentally, without compromising the strain-sensing capability of the resonator. This is nearly a 10-fold improvement over an equivalent epitaxial silicon resonant miro-extensometer (-30 ppm/degC).
Keywords :
extensometers; silicon compounds; strain sensors; thermal expansion; thin films; wide band gap semiconductors; SiC; polycrystalline silicon carbide; resonant microextensometers; single-crystalline silicon substrate; strain-sensing capability; temperature 293 K to 298 K; temperature sensitivity; temperature-insensitive silicon carbide; thermal expansion coefficient; thin film; Analytical models; Capacitive sensors; Frequency; Resonance; Semiconductor thin films; Silicon carbide; Softening; Substrates; Temperature sensors; Thermal expansion; SiC; gage; gauge; resonant; resonator; silicon carbide; strain; temperature compensation;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285513