• DocumentCode
    1854164
  • Title

    Temperature-insensitive silicon carbide resonant micro-extensometers

  • Author

    Azevedo, R.G. ; Myers, D.R. ; Pisano, A.P.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    268
  • Lastpage
    271
  • Abstract
    This work presents thin-film polycrystalline silicon carbide resonant micro-extensometers fabricated on a single-crystalline silicon substrate that are temperature-insensitive near room temperature. The slight difference in thermal expansion coefficient between the device layer and the substrate induces a slight tensile strain near room temperature, which counteracts material softening of the resonator. An analytical model that accounts for these thermal effects predicts that this system will exhibit a turnover temperature near room temperature. A temperature sensitivity of 0.7 Hz/degC (3.6 ppm/degC) from 17 to 65degC is measured experimentally, without compromising the strain-sensing capability of the resonator. This is nearly a 10-fold improvement over an equivalent epitaxial silicon resonant miro-extensometer (-30 ppm/degC).
  • Keywords
    extensometers; silicon compounds; strain sensors; thermal expansion; thin films; wide band gap semiconductors; SiC; polycrystalline silicon carbide; resonant microextensometers; single-crystalline silicon substrate; strain-sensing capability; temperature 293 K to 298 K; temperature sensitivity; temperature-insensitive silicon carbide; thermal expansion coefficient; thin film; Analytical models; Capacitive sensors; Frequency; Resonance; Semiconductor thin films; Silicon carbide; Softening; Substrates; Temperature sensors; Thermal expansion; SiC; gage; gauge; resonant; resonator; silicon carbide; strain; temperature compensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285513
  • Filename
    5285513