• DocumentCode
    1854229
  • Title

    CMOS-compatible back-end process for in-plane actuating ferromagnetic MEMS

  • Author

    Glickman, Michael ; Tseng, Po-Jung ; Harrison, Jonathan ; Goldberg, Ira B. ; Johnson, Peter ; Smeys, Peter ; Niblock, Trevor ; Judy, Jack W.

  • Author_Institution
    Electr. Eng. Dept., Univ. of California, Los Angeles, CA, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    248
  • Lastpage
    251
  • Abstract
    We have designed, fabricated, and tested in-plane actuating ferromagnetic MEMS switches and solenoidal inductors, which were produced using a CMOS-compatible back-end process. This process creates compact high-performance devices without high temperature processes (<; 400°C) or etching into the plane of the wafer.
  • Keywords
    CMOS integrated circuits; inductors; microswitches; solenoids; CMOS-compatible back-end process; MEMS switches; compact high-performance devices; inplane actuating ferromagnetic mems; solenoidal inductors; Amorphous silicon; Coils; Copper; Etching; Inductors; Lithography; Micromechanical devices; Plugs; Resists; Temperature; CMOS Compatible; Horizontal Actuation; Permalloy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285516
  • Filename
    5285516
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1854229