DocumentCode :
1854305
Title :
Van-der Waals thin-film C60 MEMS
Author :
Tin, S. ; Lal, A.
Author_Institution :
SonicMEMS Lab., Cornell Univ., Ithaca, NY, USA
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
232
Lastpage :
235
Abstract :
We report on the first-ever pristine C60 (fullerene) surface micromachined structures fabricated using an all-dry etch process. These structures are used to measure the C60 thin film MEMS electromechanical properties. These properties indicate that C60 is promising for realizing useful boundary conditions for MEMS resonators, and stiction properties for MEMS and NEMS switch applications. The clamped-clamped and clamped-free beams are fabricated with XeF2 silicon-etch process, with negligible damage to the fullerene films ensuring that predictable C60 material properties can be realized in MEMS. Under substrate-attached-PZT excitation, the resonance responses of the cantilevers and beams are measured with a laser interferometer. The elastic properties of the C60 film are thus obtained from the measured resonance frequencies.
Keywords :
etching; fullerenes; micromachining; micromechanical resonators; microswitches; nanoelectromechanical devices; thin film devices; van der Waals forces; xenon compounds; C; MEMS resonators; MEMS switch; NEMS switch applications; Van-der Waals thin-film MEMS; XeF2; all- dry etch process; cantilevers; clamped-clamped beams; clamped-free beams; electromechanical properties; etch process; fullerene surface micromachined structure fabrication; laser interferometer; microelectromechanical system; resonance frequencies; stiction properties; substrate-attached-PZT excitation; Boundary conditions; Etching; Laser beams; Material properties; Micromechanical devices; Nanoelectromechanical systems; Resonance; Semiconductor films; Switches; Transistors; C60; MEMS; Van der Waals solid; micromechanical resonator;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285520
Filename :
5285520
Link To Document :
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