• DocumentCode
    1854385
  • Title

    High-mobility copper (I) oxide thin films prepared by reactive dc magnetron sputtering for photovoltaic applications

  • Author

    Lee, Yun Seog ; Winkler, Mark T. ; Siah, Sin Cheng ; Brandt, Riley ; Buonassisi, Tonio

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    Copper (I) oxide (Cu2O) is considered a promising material for low-cost photovoltaic applications. In this contribution, high-quality Cu2O films are prepared by reactive dc magnetron sputtering. We optimize deposition parameters to achieve pure Cu2O-phase thin films. We report the control of electrical, optical, and structural properties of the resulting films by varying the substrate temperature during film growth, and carefully controlling other growth parameters. We achieve a columnar grain structure with the large average grain size (884±373 nm) and high-mobility (62 cm2/V·s) at room temperature. All films exhibit an optical bandgap between 1.9 and 2.0 eV, and the samples grown at high temperature show enhanced optical transmission at wavelengths greater than 600 nm.
  • Keywords
    copper compounds; energy gap; grain size; semiconductor growth; semiconductor thin films; solar cells; sputter deposition; Cu2O; columnar grain structure; deposition parameters; electron volt energy 1.9 eV; electron volt energy 2.0 eV; enhanced optical transmission; film growth; high-mobility copper oxide thin films; large average grain size; optical bandgap; photovoltaic cells; reactive dc magnetron sputtering; structural property; substrate temperature; temperature 293 K to 298 K; Hall effect; Optical films; Photovoltaic systems; Semiconductor device measurement; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6185892
  • Filename
    6185892