• DocumentCode
    1854606
  • Title

    Geometry-Dependent Behavior of Fibroblast Cells in Three-Dimensional Silicon Microstructures

  • Author

    Nikkhah, M. ; Strobl, J.S. ; Agah, M.

  • Author_Institution
    Virginia Tech MEMS Lab., Blacksburg
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    6077
  • Lastpage
    6080
  • Abstract
    Understanding the relationship between the cell and the substrate in microenvironments is a critical issue in cell biology research. In this paper, we report the response of HS68 normal human foreskin fibroblast cells to three-dimensional silicon microstructures, which are designed and fabricated using a single-mask fabrication technique. Our device composed of a network of microfluidic channels and microchambers with different widths and depths. Our results show that human fibroblast cells do not tend to go inside microchambers having isotropic cross sections and curved sidewalls, and moreover, their growth rate decreases as the depth increases. The growth rate decline has been utilized as a new method to create patterned cell culture.
  • Keywords
    bioMEMS; biomedical equipment; cancer; cellular biophysics; microfluidics; micromachining; silicon; skin; tumours; 3-D silicon microstructure fabrication; HS68 normal human foreskin fibroblast cells; Si; cancer diagnosis; cancer treatment; cell biology research; medical device design; microchambers; microfabrication technologies; microfluidic channel network; patterned cell culture; single-mask fabrication technique; Biological cells; Cells (biology); Etching; Fabrication; Fibroblasts; Geometry; Humans; Microfluidics; Microstructure; Silicon; Cell Aggregation; Cell Culture Techniques; Cell Line; Cell Proliferation; Equipment Design; Equipment Failure Analysis; Fibroblasts; Humans; Materials Testing; Microfluidic Analytical Techniques; Miniaturization; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353735
  • Filename
    4353735