Title :
Young´s modulus and fatigue lifetime improvements by diamond size effect on electroplated Ni-diamond nanocomposite
Author :
Huang, C.S. ; Cheng, Y.T. ; Yeh, C.J. ; Liu, H.K. ; Hsu, W.
Author_Institution :
Dept. of Mech. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
Fatigue and Young´s modulus characterizations have been investigated using the bending-test method on microsized cantilever-beam specimens made of electroplated Ni and Ni-diamond nanocomposites with different particle sizes (i.e. 350 nm and 50 nm in diameter). The experimental results show that electroplated Ni-diamond nanocomposite has slightly smaller fatigue strength than that of pure electroplated Ni due to the ductility reduction resulted by the nano-diamond particles. However, once the incorporated particle size of nano-diamond is reduced from 350 nm to 50 nm, it has been found that the electroplated Ni-diamond nanocomposite can have higher Young´s modulus (13.6% enhancement, i.e. 178GPa) and comparable fatigue strength (~2.4 GPa) with that of pure electroplated Ni.
Keywords :
Young´s modulus; diamond; electroplating; fatigue; nanocomposites; nanofabrication; nanostructured materials; nickel; Ni-C; Young´s modulus; bending-test method; diamond size effect; electroplated Ni-diamond nanocomposite; fatigue strength; microsized cantilever-beam specimens; nano-diamond particles; pressure 178 GPa; size 350 nm; size 50 nm; Computer aided engineering; Displacement control; Fabrication; Fatigue; Force measurement; Mechanical engineering; Micromechanical devices; Nanoscale devices; Silicon; Testing; Bending-test; Fatigue; MEMS; Nanocomposite; Thin film; Young´s modulus;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285535