Chip scale packaging of piezoresistive pressure sensors using the dry-film shielding

Author

Chen, Lung-Tai ; Hsu, Chung-Yi ; Pan, Jason ; Chu, C.H. ; Huang, Tyson ; Chu, Peter ; Chen, Y.S. ; Ho, C.W.

Author_Institution

Micro-Syst. Technol. Center, ITRI, Tainan, Taiwan

fYear

2009

fDate

21-25 June 2009

Firstpage

164

Lastpage

167

Abstract

In this study, chip scale packaging (CSP) for piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. Experimental results reveal that the silicon membrane of the pressure sensor is free of metal-deposition contamination and functionally operational. The packaged pressure sensor met all of the specifications of an unpackaged bare pressure sensor, holding a maximum sensing error of 0.18 psi over an operation temperature range of 25~85degC. The proposed pressure sensor packaging has advantages on both low cost and tiny packaging size, making it suitable for portable consumer products.

Keywords

chip scale packaging; consumer products; elemental semiconductors; membranes; piezoresistive devices; portable instruments; pressure sensors; shielding; silicon; bare pressure sensor; chip scale packaging; dry-film shielding; metal-deposition contamination; piezoresistive pressure sensors; portable consumer products; silicon membrane; temperature 25 C to 85 C; Biomembranes; Chip scale packaging; Costs; Electric resistance; Piezoresistance; Sensor phenomena and characterization; Silicon; Stress; Temperature sensors; Wafer scale integration; Chip scale packaging; Piezoresistive pressure sensors; dry-film;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Conference_Location

Denver, CO

Print_ISBN

978-1-4244-4190-7

Electronic_ISBN

978-1-4244-4193-8

Type

conf

DOI

10.1109/SENSOR.2009.5285539

Filename

5285539