Integrated circuits for 3GPP mobile wireless systems

Author

Nicol, Chris ; Cooke, Matthew

Author_Institution

Lucent Technol. Bell Labs., North Ryde, NSW, Australia

fYear

2002

fDate

2002

Firstpage

381

Lastpage

388

Abstract

This paper describes the architecture of integrated circuits for base-band processing in 3rd Generation (3G) mobile wireless systems. Wideband CDMA receiver functions including the RAKE, rate de/matching, channel de/interleaving, channel de/coding and multi-user detection are described. Silicon implementations of a 3GPP channel decoder and also a multi-user base-band signal processor are presented. The high speed downlink packet access (HSDPA) system providing downlink data rates in excess of 10 Mbps and the 20 Mbps multiple input/multiple output (MIMO) extensions are also described. The architecture of a 21.6 Mbps MIMO HSDPA receiver for mobile terminals with 2 or 4 antennas is shown that uses the V-BLAST MIMO detection algorithm.

Keywords

3G mobile communication; channel coding; code division multiple access; digital signal processing chips; multiuser detection; radio receivers; telecommunication standards; 21.6 Mbit/s; 3GPP mobile wireless systems; 3rd Generation Partnership Program; HSDPA receiver; RAKE; V-BLAST MIMO detection algorithm; base-band processing; channel coding; channel interleaving; downlink data rates; high speed downlink packet access; mobile terminals; multi-user detection; multiple input/multiple output; rate matching; wideband CDMA receiver functions; Decoding; Downlink; Interleaved codes; MIMO; Multiaccess communication; Multiuser detection; RAKE receivers; Signal processing; Silicon; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2002. Proceedings of the IEEE 2002

Print_ISBN

0-7803-7250-6

Type

conf

DOI

10.1109/CICC.2002.1012850

Filename

1012850