• DocumentCode
    1855058
  • Title

    Real-time electric field estimation for HVDC cable dielectrics

  • Author

    Huang, Z.Y. ; Pilgrim, J.A. ; Lewin, P.L. ; Swingler, S.G.

  • Author_Institution
    Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
  • fYear
    2015
  • fDate
    7-10 June 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    For HVDC cables, dielectric field inversion normally occurs due to the temperature drop across the insulation. Unlike AC applications where the field distribution is primarily determined by the cable geometry, the DC field can be significantly affected by the load current and hence the dielectric temperature profile. Higher temperature drops lead to higher electrical stress at the insulation screen, increasing the risk of breakdown. Thus, a real-time dielectric DC field estimator would be very useful to prevent over-stressing the cable. Theoretically, the electrical field can be calculated from the overall dielectric temperature drop. Therefore, by monitoring the temperature profile and integrating with mathematical algorithms, the DC field distribution might be assessed in real time. In this paper, a mathematical algorithm for calculation of the DC field is demonstrated, using standard online temperature monitoring techniques.
  • Keywords
    HVDC power transmission; dielectric materials; electric breakdown; power cable insulation; HVDC cable dielectrics; breakdown risk; dielectric field inversion; dielectric temperature drop; dielectric temperature profile; electrical stress; high voltage power cable transmission; insulation screen; load current; mathematical algorithm; real-time dielectric DC field estimator; real-time electric field estimation; standard online temperature monitoring technique; Cable insulation; Conductivity; Dielectrics; Mathematical model; condition monitoring; electric breakdown; power cable insulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2015 IEEE
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4799-7352-1
  • Type

    conf

  • DOI
    10.1109/ICACACT.2014.7223560
  • Filename
    7223560