DocumentCode
1855387
Title
Dielectric strength of alternative insulation gases at high pressure in the homogeneous electric field
Author
Hopf, Andreas ; Rossner, Michael ; Berger, Frank ; Prucker, Udo
Author_Institution
Fac. Electr. Eng., Univ. of Appl. Sci. Coburg, Coburg, Germany
fYear
2015
fDate
7-10 June 2015
Firstpage
131
Lastpage
136
Abstract
Sulphur hexafluoride (SF6) is the most common insulation gas in high voltage technology. Besides the excellent insulation properties SF6 has the most known global warming potential with a long lifetime in the atmosphere. Alternative insulation gases have only a fraction of the insulation level of SF6. The electric strength of gases depends on the gas density and can be increased significantly by using higher pressure. The aspirants were Nitrogen, air and N2-SF6-mixtures, with small admixture of SF6. The electron affinity of SF6 increases the dielectric strength of N2 strongly. In general the dielectric strength of SF6 is three times higher compared to air. Therefore the alternative insulation gases must set under high pressure to get equivalent dielectric strength. With these measurements the electrical breakdown strength of alternative insulation gases in quasi-homogeneous electric fields and the applicability of the Paschen parameters at high pressure have been investigated.
Keywords
SF6 insulation; electric fields; electric strength; electron affinity; N2-SF6-mixtures; Paschen parameters; air; alternative insulation gases; dielectric strength; electrical breakdown strength; electron affinity; gas density; high voltage technology; insulation properties; nitrogen; quasihomogeneous electric fields; sulphur hexafluoride; Breakdown voltage; Integrated circuits; Pulse measurements; Sulfur hexafluoride; Switches; Temperature measurement; Voltage measurement; Paschen law; SF6 ; Streamer; dry air; electrical strength; free meanpath; high pressure insulation; impact ionization;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2015 IEEE
Conference_Location
Seattle, WA
Print_ISBN
978-1-4799-7352-1
Type
conf
DOI
10.1109/ICACACT.2014.7223575
Filename
7223575
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